BIG:Tech 

Print & Place: Using a 3D printer for Continuous Assembly of Electronic Devices

2026. Proceedings of the 39th Annual ACM Symposium on User Interface Software and Technology (UIST '26).

Oliver Child, Patrick Baudisch & Mike Fraser.

Print & Place is a novel process that appropriates unmodified commodity FDM 3D printers to enable in-situ pick-and-place of electronic components. Traditionally, producing functional 3D-printed electronics has required manual assembly, extensive post-processing, or compromises using high-resistance filaments. Our approach overcomes these barriers by automating the continuous positioning, electrical connection, and encapsulation of parts throughout the print process, broadening the range of devices that can be additively manufactured. Our method leverages adhesion from cooled beads of extruded thermoplastic to pick up and place elements within an evolving 3D structure. We present a workflow that integrates mechanical and electronics design with job preparation, generating a part-placement tray and custom pick-and-place movements. We characterise the adhesive performance, electrical reliability, and operational limits of the technique. Finally, we demonstrate how Print & Place enables the fabrication of fully encapsulated electronic devices, advancing additive manufacturing from geometric fabrication toward the production of functionally integrated, bespoke devices.